W956D6HBCX7I TR

W956D6HB 64Mb Async./Burst/Sync./A/D MUX 1. GENERAL DESCRIPTION Winbond x16 ADMUX products are high-speed, CMOS pseudo-static random access memory developed for lowpower, portable applications. The device has a DRAM core organized. These devices are a variation of the industrystandard Flash control interface, with a multiplexed address/data bus. The multiplexed address and data functionality dramatically reduce the required signal count, and increase READ/WRITE bandwidth. For seamless operation on a burst Flash bus, Winbond x16 ADMUX products incorporate a transparent self-refresh mechanism. The hidden refresh requires no additional support from the system memory controller and has no significant impact on device READ/WRITE performance. Two user-accessible control registers define device operation. The bus configuration register (BCR) defines how the Winbond x16 ADMUX device interacts with the system memory bus and is nearly identical to its counterpart on burst mode Flash devices. The refresh configuration register (RCR) is used to control how refresh is performed on the DRAM array. These registers are automatically loaded with default settings during power-up and can be updated anytime during normal operation. Special attention has been focused on standby current consumption during self refresh. Winbond x16 ADMUX products include two mechanisms to minimize standby current. Partial-array refresh (PAR) enables the system to limit refresh to only that part of the DRAM array that contains essential data. Temperature-compensated refresh (TCR) uses an on-chip sensor to adjust the refresh rate to match the device temperature—the refresh rate decreases at lower temperatures to minimize current consumption during standby. The system-configurable refresh mechanisms are accessed through the RCR. Winbond x16 ADMUX is compliant with the industry-standard CellularRAM 1.5 x16 A/D MUX. 2. FEATURES •Supports asynchronous and burst operations • VCC, VCCQ Voltages: 1.7V–1.95V VCC 1.7V–1.95V VCCQ • Random access time: 70ns • Burst mode READ and WRITE access: 4, 8, 16, or 32 words, or continuous burst Burst wrap or sequential Max clock rate: 133 MHz (tCLK = 7.5ns) • Low power consumption: Asynchronous READ: 20ns. 4. CE# must go HIGH before any clock edge following the last word of a defined-length burst. - 48 - Publication Release Date : May 29,2013 Revision : A01-003 W956D6HB 64Mb Async./Burst/Sync./A/D MUX 10.2.14 Burst WRITE Terminate at End of Row (Wrap Off) CLK VIH VIL tCLK VIH A [max:16 ] VIL ADV # VIH VIL VIH LB # /UB # VIL WE # VIH VIL OE# VIH VIL CE # tcsp tHD VIH Note 2 VIL t SP t HD VIH A/DQ[15:0 ] VIL Valid input Valid input Valid input END OF ROW tHZ WAIT t HZ VOH VOL High - Z tKOH tKHTL Don' t Care Undefined Notes: 1. Non-default BCR settings for burst WRITE at end of row: fixed or variable latency, WAIT active LOW, WAIT asserted during delay (shown as solid line). 2. For burst WRITEs, CE# must go HIGH before the second CLK after the WAIT period begins (before the second CLK after WAIT asserts with BCR[8] = 0, or before the third CLK after WAIT asserts with BCR[8] = 1). - 49 - Publication Release Date : May 29,2013 Revision : A01-003 W956D6HB 64Mb Async./Burst/Sync./A/D MUX 10.2.15 Burst WRITE Row Boundary Crossing VIH VIL CLK t CLK A[max:16] VIH VIL ADV # VIH VIL LB# / UB # VIH VIL WE # OE# VIH VIL VIH VIL VIH CE# V IL VIH A/DQ[15:0] VIL WAIT t SP t HD Valid input End of row Valid input Valid input Valid input Valid input t KHTL VOH t KHTL V OL t KOH Note 2 t KOH Don' t Care Undefined Notes: 1. Non-default BCR settings for burst WRITE at end of row: fixed or variable latency, WAIT active LOW, WAIT asserted during delay (shown as solid line). 2. WAIT will be asserted for LC cycles for variable latency, or LC cycles for fixed latency. - 50 - Publication Release Date : May 29,2013 Revision : A01-003 W956D6HB 64Mb Async./Burst/Sync./A/D MUX 10.2.16 Burst WRITE Followed by Burst READ VIH CLK VIL A[max:16] VIH VIL VIH ADV# VIL tCLK tSP tHD tSP tHD Valid Valid Valid Address Address Address tSP tHD tSP LB#/UB# VIH VIL tHD t CBPH Note 2 OE # VIH VIL VIH WE# VIL tHD tCSP VIH CE# VIL tSP tSP tHD A/DQ[15:0] VIH Valid Address IN/OUT VIL VOH High-Z t HD WAIT VOL tHD tSP t CSP tOHZ tSP tHD tSP tHD t BOE t SP tHD D0 D1 D2 D3 Valid address VOH VOL tACLK tKOH Valid Output Valid Output Valid Output Valid Output High- Z Don' t Care Undefined Notes: 1. Non-default BCR settings for burst WRITE followed by burst READ: fixed or variable latency, latency code 2 (3 clocks), WAIT active LOW, WAIT asserted during delay. 2. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH, or b) CE# HIGH for longer than 15ns. - 51 - Publication Release Date : May 29,2013 Revision : A01-003 W956D6HB 64Mb Async./Burst/Sync./A/D MUX 10.2.17 Asynchronous WRITE Followed by Burst READ CLK A[max:16] tCLK VIH VIL VIH VIL ADV# VIH VIL LB #/ UB # VIH VIL CE # VIH VIL t SP Valid address t AVS t AS t AS t HD Valid address t AVH t SP tHD t VP tBW t HD tSP tCBPH tCW tCSP tOHZ Note 2 OE # VIH VIL WE # VIH VIL A/DQ[15:0] VIH VIL tWC t WP t AS VOH VOL t SP tHD Valid address t AVS WAIT t SP tHD tAVH Data tDW tDH VOH VOL tKHTL tBOE Valid output Valid address t ACLK Valid output Valid output t KOH Valid output High- Z Don't Care Undefined Notes: 1. Non-default BCR settings for asynchronous WRITE, with ADV# LOW, followed by burst READ: fixed or variable latency, latency code 2 (3 clocks), WAIT active LOW, WAIT asserted during delay. 2. When the device is transitioning between asynchronous and variable-latency burst operations, CE# must go HIGH. CE# can stay LOW when the device is transitioning to fixed-latency burst READs. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH, or b) CE# HIGH for longer than 15ns. - 52 - Publication Release Date : May 29,2013 Revision : A01-003 W956D6HB 64Mb Async./Burst/Sync./A/D MUX 10.2.18 Burst READ Followed by Asynchronous WRITE tCLK CLK V IH VIL V IH A[max: 16 ] VIL V IH ADV # VIL tSP t HD Vaild address Valid address t AVS tAVH t AS tSP t HD CE # V IH VIL OE # V IH VIL WE # V IH VIL WAIT VOH VOL tVP t CW Note 2 t BOE tSP tHD tSP High-Z t WP VOH VOL t WPH t BW tHD t SP tHD Valid address t OHZ tOLZ V IH LB#/ UB# VIL V IH A/DQ [15:0] VIL tCBPH t HZ t AS tHD t CSP t AW t VS t ACLK tKOH Valid output tKOH t AS VIH VI L t AVS tAVH Valid address tDW tDH Valid Input High - Z tKHTL READ Burst Identified ( WE # = HIGH ) t KHTL Don' t Care Undefined Notes: 1.Non-default BCR settings for burst READ followed by asynchronous WRITE using ADV#: fixed or variable latency, latency code 2 (3 clocks), WAIT active LOW, WAIT asserted during delay. 2.When the device is transitioning between asynchronous and variable-latency burst operations, CE# must go HIGH. CE# can stay LOW when the device is transitioning from fixed-latency burst READs; asynchronous operation begins at the falling edge of ADV#. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH, or b) CE# HIGH for longer than 15ns. - 53 - Publication Release Date : May 29,2013 Revision : A01-003 W956D6HB 64Mb Async./Burst/Sync./A/D MUX 10.2.19 Asynchronous WRITE Followed by Asynchronous READ VIH A[max:16] VIL VIH ADV# VIL Valid address t AVS t AVH t AS t AW tVP VIH WE# t AVH tVP tBHZ tCVS t BW t BA tCPH t CVS t AA t AADV t WR t VS t HZ t CO t CW Note 1 VIL OE# tOLZ t OE VIH VIL VIL VOH tOHZ tWP VIH VIH A/DQ[15:0] VIL WAIT t AVS tAS VIH LB#/UB# VIL CE# Valid address t AS Valid address t AVS Valid input t AVH tDS Data Valid address tAVS t AVH t DH VOH Valid Output VOL t AA tOEW t AW tHZ High - Z VOL Don't Care Undefined Notes: 1.When configured for synchronous mode (BCR[15] = 0), CE# must remain HIGH for at least 5ns (tCPH) to schedule the appropriate refresh interval. Otherwise, tCPH is only required after CE#-controlled WRITEs. - 54 - Publication Release Date : May 29,2013 Revision : A01-003 W956D6HB 64Mb Async./Burst/Sync./A/D MUX 11. PACKAGE DESCRIPTION 11.1 Package Dimension VFBGA 54BALL (6X8 mm^2,Ball pitch:0.75mm, Ø =0.4mm) Note: 1. Ball land:0.45mm. Ball opening:0.35mm. PCB ball land suggested